Condenser arrangement



y 1942- R. KIELHORN 2,290,912

CONDENSER ARRANGEMENT Filed Jan. 27, 1939 Patented July 28, 1942 2,290,912 CONDENSER ARRANGEMENT Richard Kielhorn, Berlin, Germany, assignor to C. Lorenz Aktiengesellschaft, Berlin-Tempe!- hof, Germany, a company Application January 27, 1939, Serial No. 253,154

2 Claims.

It is customary in high frequency systems to employ condensers of a definite capacity value which are composed of a number of component condensers mounted on a carrier or support common to them. This arrangement has the advantage that such condensers may be given any capacity value according to the number of unit condensers employed.

The invention aims to improve arrangements of this kind. To such end the component condensers are mounted in a ceramic base plate provided with recesses in which one end of the component condensers, which preferably are' of cylindrical shape, is inserted.

In the accompanying drawing Figs. 1 and 2 are elevations showing one embodiment of the invention, Fig. 3 is a plan thereof, while Fig. 4 represents a section on line 4-4 of Fig. 3. I I

In a ceramic base plate I recesses 2 are provided in which one end of cylindrical component condensers I, 8, 9, I is seated. Preferably these condensers are partially made of ceramic material. The condensers I, -8, 9, III are secured in these recesses by soldering. As the individual condensers are to be connected in parallel an excavation or groove 4 is provided in the lower surface of plate I. This excavation is fitted with a metal coating, made of silver, for instance, and

is filled with the solder 25 in'such manner that by soldering the condensers to the plate I they will be electrically interconnected by the solder. Terminal lugs 22 may be provided to complete Germany January 26, 1938 circuits for the circuit elements mentioned, as for example lug 22 on element 2| and lug 22" on element 20. A connection lead 23 serves to complete the parallel connection of elements I, 8, 9,

' III by connecting their lugs 22. Similar excavations or grooves in base plate I may also be provided as'required to make connections to further circuit elements II, I2, and I3, as will be clear.

Furthermore, on plate I also supports I4, I I6, II are arranged to carry additional componentcondensers I8, I9, 20, 2| of a capacity smaller than that of the condensers I, 8, 9, Ill.

I in the lower surface of said plate interconnectin said holes, a plurality of condensers positioned on the upper surface of said plate and solder in said groove and holes serving to interconnect said condensers. v

RICHARD KIELHORN. 

